• Northrop Grumman is leading the push to bring semiconductor manufacturing back to the US.
• The company is opening its Microelectronics Center to external aerospace and defense companies.
• Advanced packaging is becoming essential to overcoming the limits of traditional semiconductor manufacturing.
• The goal is to deliver mission-tailored, resilient, and secure microelectronics to the defense industry.

This development may indicate a shift in the US defense industry's approach to semiconductor production, potentially leading to a more resilient and self-sufficient supply chain. The emphasis on advanced packaging and onshoring may also signal a growing recognition of the importance of domestic manufacturing in supporting national security interests.